Laser Cutting

We do small batch laser cutting specializing in silicon wafer cut down for reclaim.


We have various machining capabilities. General milling and turning in low to medium production.

Mill Turn

Our full production line of mill/turn B axis mill turn and swiss screw machining holding tight tolerances for all applications.


High Volume Machining

In our high volume automated Mill/Turn, Swiss Machining centers we keep costs extremely low along with high continued accuracy. We can do 100% CMM inspection directly out of machine to keep production scrap to a minimum.